HTE ED Copper foil used for PCB as per IPC 4562

Description
HTE ED Copper Foil

Nominal Thickness: 12/15/18/35/50/70um
Width: max 1290mm
Cu Content: 99.8%
Tensile Strength: max 280MPA
Elongation: min 4%
Peel Strength: min 1.20kg/cm
Roughness of Shiny side: max 0.4Ra
Roughness of Matte side: max 5~20.0 Rz
High temperature elongation
Standard: IPC 4562
Application: CCL, PCB, EMI Shielding material
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